New versatile System for magnetron and thermo resistance sputtering for batch wafer processing STE MS900 System allows to sputter multicomponent layers (metals, resistant layers etc.) on the substrate heated up to 500°C. System is designed for both active R&D and small­scale production. Maximum number of sputtering substrates in the same process: 150 mm – 6 pcs. Targets with diameter of 6’’ ensure uniformity of ±2% for 100 mm. Magnetic mount makes targets replacement very easy.