Description
1) A wide range of transformers, inductors, chokes, wiring harnesses, wire and cable connections are made.
2) Automatic installation of surface-mounted products on multi-layer printed circuit boards up to 510x540 mm thick and up to 4.5 mm thick using a high-speed stencil printer P4 I-PULSE (Yamaha, Japan), surface-mounted machines M6ex and M20 (Japan) and furnaces convection reflow GoReflow 2.3 (Germany) with the subsequent application of moisture-proof coatings. The washing of the printed circuit assemblies is carried out at the SBC-55 jet washer (Finland). The accuracy of the installation of the chip - components +/- 0.040 mm, IC +/- 0.025 mm. Component sizes 01005 ÷ 120x90 mm, BGA, CSP, connectors, etc. Package of components: tape (8-56 mm), canisters, pallets.
3) Installation of surface-mounted products on printed circuit boards using the semi-automatic screen printing SP003 (ESSEMTEC, Switzerland), semi-automatic installation PMI SM 902.210 (Germany), as well as soldering stations MBT 250E, LF-1600 (XYTRONIC).
4) The complex disassembly of chips is carried out during the repair of printed circuit boards on the semi-automatic repair center BGA EasyPlacer, reballing with the help of a station with automatic centering on the WZ-200 thermoplatform.
5) The quality control of the installation is carried out using an optical inspection system of K5L printed circuit boards (Yamaha, Japan), MANTIS FX visual inspection systems and 8РК-F 1205 DB shadowless magnifying lamps. The quality control of the installation of microcircuits in BGA, QFN, and other types of enclosures is carried out using the micromex 180 X-ray inspection system.
2) Automatic installation of surface-mounted products on multi-layer printed circuit boards up to 510x540 mm thick and up to 4.5 mm thick using a high-speed stencil printer P4 I-PULSE (Yamaha, Japan), surface-mounted machines M6ex and M20 (Japan) and furnaces convection reflow GoReflow 2.3 (Germany) with the subsequent application of moisture-proof coatings. The washing of the printed circuit assemblies is carried out at the SBC-55 jet washer (Finland). The accuracy of the installation of the chip - components +/- 0.040 mm, IC +/- 0.025 mm. Component sizes 01005 ÷ 120x90 mm, BGA, CSP, connectors, etc. Package of components: tape (8-56 mm), canisters, pallets.
3) Installation of surface-mounted products on printed circuit boards using the semi-automatic screen printing SP003 (ESSEMTEC, Switzerland), semi-automatic installation PMI SM 902.210 (Germany), as well as soldering stations MBT 250E, LF-1600 (XYTRONIC).
4) The complex disassembly of chips is carried out during the repair of printed circuit boards on the semi-automatic repair center BGA EasyPlacer, reballing with the help of a station with automatic centering on the WZ-200 thermoplatform.
5) The quality control of the installation is carried out using an optical inspection system of K5L printed circuit boards (Yamaha, Japan), MANTIS FX visual inspection systems and 8РК-F 1205 DB shadowless magnifying lamps. The quality control of the installation of microcircuits in BGA, QFN, and other types of enclosures is carried out using the micromex 180 X-ray inspection system.