Description:
Flat package (FP) is a rectangular package with leads parallel to base plane attached on two opposing sides of the package periphery;
Leadframes are brazed on the top of a multilayer ceramic substrate;
The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Printed-circuit-board surface-mount-component package;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:
Increased Reliability Integrated Circuits