Products
Hermetic Packages for Integrated Circuits
Supplier: The Ruselectronics holding company
Transistor Outline Style Package TO-3 or “metal can”or Metal Header Package
Unit designation Corps: 311.8-2, 311.10-1, 3206.8-1
Number of Pins: 8 insulated
Hermetic Packages for Low and Medium Power Integrated Circuits
Supplier: The Ruselectronics holding company
Ceramic Leaded Chip Carriers or Flat Packs 402.16-32; 402.16-33; 402.16-41
Number of Pins: 16
Package type – 8-lead Glass-to-Metal Flatpack Package KUYAL
Supplier: The Ruselectronics holding company
Unit designation Corps: KUYAL 431433.019 KUYAL 754529.021
Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2102.14-10
Supplier: The Ruselectronics holding company
Number of Pins: 14 insulated
Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2103.16-22
Supplier: The Ruselectronics holding company
Number of Pins: 16 insulated
Hermetic SMD Package – КТ-93-2 (SMD-0.5)
Supplier: The Ruselectronics holding company
Number of Pins: 3
Technochemical equipment for semiconductor production
Supplier: The Ruselectronics holding company
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A set of equipment for the techno-chemical processing of substrates in the production of microstrip boards consisting of: Gold chemical deposition line; Copper surface preparation line before applying photoresist on conductor layers and before gilding; Pickling line resistive layers; Line of chemical preparation of substrates before deposition of resistive and conductive layers; Line preliminary chemical preparation of substrates before spraying.
